Samsung is expected to use either the in-house developed Exynos 2700 or the Qualcomm Snapdragon 8 Elite Gen 6 Pro for Galaxy chipset in its next flagship non-foldable smartphone lineup, the Galaxy S27 series, depending on the market.
Leaks about the Exynos 2700 started surfacing even before the brand unveiled the Exynos 2600, which debuted with the Galaxy S26. However, the brand had never officially acknowledged the existence of the next-generation SoC. That's changing today.
Samsung's President for System LSI, Park Yong-In, during a briefing on the division’s management status, confirmed that the company is developing the Exynos 2700 chipset (via Hankyung). As far as we can tell, this is the first time Samsung or one of its executives has publicly mentioned the SoC.
Park added, “We are developing it without any setbacks, aiming for application in top-tier smartphones.” The tech giant's next flagship phones are said to be the Galaxy Z Fold 8, Galaxy Z Fold 8 Ultra, Galaxy Z Flip 8, and the Galaxy S27 series. Since the Exynos 2700 is unlikely to be ready in time for the upcoming foldables, Park was most likely referring to the Galaxy S27 lineup.
According to previous reports, Samsung will manufacture the Exynos 2700 using Samsung Foundry's SF2P process. The chipset is also said to feature a Heat Path Block and a Side-by-Side architecture to improve thermal management and performance. However, the brand may slip using Fan-Out Wafer-Level Packaging (FOWLP) to cut down production costs.
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